The information in this guide is provided for instructional and educational purposes only. There is no guarantee that these instructions will work under your specific and unique circumstances. Use these instructions at your own risk.
We shall not hold any responsibility or liability for whatever happens to you or your device arising from your use of the info in this guide. Read and understand the whole guide first before actually performing the instructions. Backup all personal data on your phone to make sure you have a copy of your personal data e.
For backup tips, check our guides on how to sync your data to the cloud and how to create local backups of your mobile data. Terminal Emulator installed on your phone. You can get your copy by downloading it from the Google Play Store. Switch off your phone. Boot into ClockworkMod Recovery. You can do this by pressing and holding down the Volume Up, Home, and Power buttons together until your phone screen turns on. Use the Volume buttons to navigate and the Power button to select once inside recovery.
Confirm the installation process by selecting Yes on the screen that follows. The packing requirements include some combination of the following, depending on MSL class:. The Dry-Bake process is required to dry off the absorbed moisture in the non-hermetic package before packing. It has to be performed according to the criteria and conditions in reference to MSL classification and body thickness of the non-hermetic package. Table 2 below shows the dry-bake criteria and conditions.
Based on the MSL classification, the floor life of the non-hermetic package is determined and controlled. The floor life of the package begins after unsealing of the bag. Table 3 below shows the floor life and condition for each MSL class.
The floor life control ends after the surface-mount solder reflow process is completed. In the event that the non-hermetic package is exposed to atmosphere beyond the controlled floor life, dry-bake is required to extend floor life before future surface-mount solder reflow process. Dry-bake to extend floor life has to be performed according to the criteria and conditions in reference to the MSL classification and body thickness of the non-hermetic package.
Table 4 below shows the dry-bake criteria and conditions to extend floor life. Mini-Circuits understands the importance and significance of Moisture Sensitivity Level MSL requirements, and we fully expect our products to be reliable.
In addition to providing state-of-the-art, high-performance products, we want our customers to enjoy ease of use and to incur the lowest possible costs in using our products. We know that customers will have to implement tedious and costly procedures to use non-MSL 1 rated products.
Accordingly, our design and manufacturing processes are carefully determined from concept to realization, each bill of material is carefully selected, and a variety of designs and testing methods are conducted to ensuring we meet, maintain and exceed MSL 1 classification. This technical excellence brings about many advantages and benefits to customers who select Mini-Circuits as their preferred components supplier.
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